USTC has made new progress in the field of power management chip design...
數(shù)據(jù)猿 | 2023-03-22 20:51
【數(shù)據(jù)猿導(dǎo)讀】 Recently, a high-efficiency, high-current-density Buck-Boost DC-DC Converter (Buck-Boost DC-DC Converter) chip designed by Prof. ISSCC, the highest level conference in the field of design....
Recently, a high-efficiency, high-current-density Buck-Boost DC-DC Converter (Buck-Boost DC-DC Converter) chip designed by Prof. ISSCC, the highest level conference in the field of design. ISSCC is the place where the most cutting-edge chip design technology is published in the world, and it has received great attention in academia and industry, and is also known as the "Chip Olympics". ISSCC 2023 will be held in San Francisco, USA from February 19th to 23rd this year.
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